ultra fast recovery power rectifier semelab plc reserves the right to change test condi tions, parameter limits and package dimensions with out notice. information furnished by semelab is believed to be both accurate and reliable at the time of going to press. however semelab assumes no responsibility for any errors or omissions discovered in its use. semelab encourage s customers to verify that datasheets are current before placing a n order. semelab semelab semelab semelab plc plcplc plc coventry road, lutterworth, leicestershire, le17 4 jb document number 9036 telephone +44 (0) 1455 556565 fax +44 (0) 1455 552612 issue 2 email: sales@semelab-tt.com website: http://www.semelab-tt.com page 1 of 4 1n5809d3a / 1n5809d3b dlcc3 - light weight hermetic ceramic surface mount package is designed as a drop in replacement for ?d -5b? / ?e- melf? package ? ultra fast reverse recovery switching power supply applications space level and high-reliability screening options av ailable absolute maximum ratings (t a = 25c unless otherwise stated) v br breakdown voltage 110v v rwm working peak reverse voltage 100v i o maximum rectified current i o 1 = t a +55c (1) 3.0a derate above t a 55c 25ma/c i fsm surge current, t p = 8.3ms (2) 125a t j junction temperature range -65 to +175c t stg storage temperature range -65 to +175c thermal properties symbols parameters max. units r jsp(in) thermal resistance, junction to solder pads t sp = 25c 17 c/w r ja (pcb) (3) thermal resistance, junction to ambient, on pcb 50 c/ w r ja (pcb) (4) thermal resistance, junction to ambient, on pcb 117 c/w notes notes notes notes (1) i o1 is rated at 3.0a @ t a = 55 c for pc boards where thermal resistance from mount ing point to ambient is sufficiently controlled whe re t j(max) does not exceed 175 c; this equates to r ja(pcb) 52c/w. (2) t a = 25 c @ i o =3.0a and v rwm for ten 8.3ms surges at 1 minute intervals. (3) pcb = fr4, 0.0625 inch (1.59mm) thick, single layer , 1.0-oz cu, pad size, (1.0? x 1.0?), (645mm x 645m m) , horizontal in still air. (4) pcb = fr4, 0.0625 inch (1.59mm) thick, single layer , 1.0-oz cu, pad size, (0.070? x 0.155?)?, (1.78mm x 3.94mm) ?, horizontal in still air. i o1 is rated at 1.5a @ t a = 55 c for pc boards where r ja(pcb) 120c/w. derate at 12.5ma/c above t a = 55 c in this case. ? recommended solder pad layout dimensions for this device, as detailed within this datasheet for the d-5b device.
ultra fast recovery power rectifier 1n5809d3a / 1n5809d3b semelab semelab semelab semelab plc plcplc plc coventry road, lutterworth, leicestershire, le17 4 jb document number 9036 telephone +44 (0) 1455 556565 fax +44 (0) 1455 552612 issue 2 email: sales@semelab-tt.com website: http://www.semelab-tt.com page 2 of 4 electrical characteristics (t a = 25c unless otherwise stated) symbols parameters test conditions min. typ. max. units i r = 100a 110 v br (5) breakdown voltage t a = -65c 100 i f = 3.0a 0.865 i f = 4.0a 0.875 t a = 125c 0.800 t a = -65c 1.075 v f (5) forward voltage i f = 6.0a 0.925 v v r = 100v 5.0 i r (5) reverse current t a = 125c 525 a dynamic characteristics i f = i rm = 1.0a i rec = 0.1a t rr reverse recovery time di/dt = 100a/s (min) 50 ns v fr forward recovery voltage i f = 500ma t r = 8ns 2.2 v t fr forward recovery time i f = 500ma, t p 20ns, t r = 8ns 15 ns c j capacitance v r = 10v f = 1.0mhz 85 pf notes notes notes notes (5) pulse width 300us, 2%
ultra fast recovery power rectifier 1n5809d3a / 1n5809d3b semelab semelab semelab semelab plc plcplc plc coventry road, lutterworth, leicestershire, le17 4 jb document number 9036 telephone +44 (0) 1455 556565 fax +44 (0) 1455 552612 issue 2 email: sales@semelab-tt.com website: http://www.semelab-tt.com page 3 of 4 mechanical data a d c c b 1 2 sml d3a a d c c b 1 2 3 sml d3b dlcc3 variant a (d3a) pad 1 anode pad 2 cathode dimension mm inches a 7.00 0.10 0.275 0.004 b 3.65 0.10 0.143 0.004 c 1.60 0.10 0.063 0.004 d 1.76 0.10 0.069 0.004 dlcc3 variant b (d3b) pad 1 anode pad 2 cathode pad 3 lid contact to cathode* dimension mm inches a 7.00 0.10 0.275 0.004 b 3.65 0.10 0.143 0.004 c 1.60 0.10 0.063 0.004 d 1.76 0.10 0.069 0.004 * the additional contact provides a connection to t he lid in the application. connecting the metal lid to a known electrical potential stops deep dielectric discharge in space applications; see the space weather link www.semelab.co.uk/dlcc3.html on the semelab web site. package variant to be specified at order. ? the dlcc3 package design takes full advantage of t he proven high reliability pedigree of the htcc sur face mount packaging technology, which is easily integrated for automated assembly. semelab has taken the existing standards for ceram ic surface mount package manufacture and added additional design features to enhance the rmal performance, to present a competitive alternat ive for high reliability applications. solder pad layout a b c soldering temperature should be 260c for a maximum of 10 seconds. the physical dimensions for the dlcc3 ceramic packa ge are designed to be different from the published dimensions for t he ?d-5b? and ?e- melf? outlines. the dlcc3 design fully utilises th e recommended solder footprint for the ?d-5b? / ?e-melf? package, and as such presents a drop in replacement for existing board d esigns. package mass gold plated solder pad finish = 150mg mm inches a 7.32 0.288 b 1.78 0.070 c 3.94 0.155
ultrafast recovery power rectifier diode 1n5809d3a / 1n5809d3b semelab semelab semelab semelab plc plcplc plc coventry road, lutterworth, leicestershire, le17 4 jb document number 9036 telephone +44 (0) 1455 556565 fax +44 (0) 1455 552612 issue 2 email: sales@semelab-tt.com website: http://www.semelab-tt.com page 4 of 4 screening options space level (jqrs/esa) and high reliability options a re available in accordance with the high reliability and screening options handbook available for download from the from the tt electronics semelab web site. esa quality level products are based on the testing procedures specified in the generic escc 5000 and in the corresponding part detail specifications. semelab?s qr216 and qr217 processing specifications (jqrs), in conjunction with the companies iso 9001: 2000 approval present a viable alternative to the america n mil- prf-19500 space level processing. qr217 (space level quality conformance) is based on the quality conformance inspection requirements of mil- prf- 19500 groups a (table v), b (table via), c (table vi i) and also esa / escc 5000 (chart f4) lot validation tests. qr216 (space level screening) is based on the scree ning requirements of mil-prf-19500 (table iv) and also e sa /escc 5000 (chart f3). jqrs parts are processed to the device data sheet a nd screened to qr216 with conformance testing to q217 groups a and b in accordance with mil-std-750 method s and procedures. additional conformance options are available, for ex ample pre-cap visual inspection, buy-off visit or data pac ks. these are chargeable and must be specified at the o rder stage (see ordering information). minimum order quantities may apply. alternative or additional customer specific conforma nce or screening requirements would be considered. contact semelab sales with enquires. marking details parts can be laser marked with approximately 7 char acters on two lines and always includes cathode identifica tion. typical marking would include part or specification number, week of seal or serial number subject to available space and legibility. customer specific marking requirements can be arrang ed at the time of order. example marking: ordering information part numbers are built up from type, package varian t, and screening level. the part numbers are extended to i nclude the additional options as shown below. type ? see main part number package variant ? see mechanical data screening level ? see screening options (esa / jqrs) additional options: customer pre-cap visual inspection .cvp customer buy-off visit .cvb data pack .da solderability samples .ss scanning electron microscopy .sem radiography (x-ray) .xray total dose radiation test .rad mil-prf-19500 (qr217) group b charge .grpb group b destructive mechanical samples .gbdm (12 pi eces) group c charge .grpc group c destructive electrical samples .gcde (12 pi eces) group c destructive mechanical samples .gcdm (6 pie ces) esa/escc lot validation testing (subgroup 1) charge .lvt1 lvt1 destructive samples (environmental) .l1de (15 pieces) lvt1 destructive samples (mechanical) .l1dm (15 pie ces) lot validation testing (subgroup 2) charge .lvt2 lvt2 endurance samples (electrical) .l2d (15 pieces ) lot validation testing (subgroup 3) charge .lvt3 lvt3 destructive samples (mechanical) .l3d (5 piece s) additional option notes: 1) all ?additional options? are chargeable and must be specified at order stage. 2) when group b,c or lvt is required, additional el ectrical and mechanical destructive samples must be ordered 3) all destructive samples are marked the same as o ther production parts unless otherwise requested. example ordering information: the following example is for the 1n5809d3 part with package variant b, jqrs screening, additional group c conformance testing and a data pack. part numbers: 1n5809d3b-jqrs (include quantity for flight parts) 1n5809d3b-jqrs.grpc (chargeable conformance option) 1n5809d3b-jqrs.gcde (charge for destructive parts) 1n5809d3b-jqrs.gcdm (charge for destructive parts) 1n5809d3b-jqrs.da (charge for data pack) customers with any specific requirements (e.g. marki ng or screening) may be supplied with a similar alternati ve part number (there is maximum 20 character limit to part numbers). contact semelab sales with enquiries. high reliability and screening options handbook link : http://www.semelab.co.uk/pdf/misc/documents/hirel_ and_screening_options.pdf
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